Wafer Cleaving Pliers 
order #52-002006 Wafer Cleaving Pliers
Product description
The wafer cleaving pliers are designed for making clean breaks in silicon wafers,thin glass, thin quartz and similar materials. The can be used for either cleaving/breaking or nipping. These wafer cleaving pliers (also called glass running or glass breaking pliers) include two sets of jaw inserts:
- A soft set with molded ridges to facilitate a clean break over a scored line. The white indication line on the jaws enables exact positioning over the scored line
- A flat metal set for nipping a thin strip along a parallel scored line
Made of lightweight, durable, strong reinforced plastic with ergonomically molded handles. Overall length is 152mm.
Always wear safely glasses and gloves when handling glass or similar material.
For cleaving or breaking applications.
Use the soft plastic jaw insert for cleaving or breaking out. The jaw insert with the double ridge on the jaw with the white line. The jaw insert with the single ridge in the opposite jaw.
Insert the glass, wafer approximately 10-15mm into the plier jaws. Align the centre ridge under the score made in the top surface. The white line assists in making proper alignment. Squeeze gently until the material cleaves or breaks out.
For nipping applications.
Removing the jaw inserts.
To remove the jaw inserts, place a small screwdriver or thin object under lower rear of the side locking tab and pry gently.
Technical Support Bulletin: TSB 52-002006 Wafer Cleaving Pliers Revision 1
